Allocation
The component market's recurring weather: demand outrunning supply until manufacturers ration deliveries, lead times stretch from weeks to months, and buyers meet the gray market for the first time. Allocation cycles are why alternates are approved in advance, why lifetime-buy authority is assigned before scarcity, and why a supplier's channel discipline is a specification item rather than their private business.
Automated optical inspectionAOI
Camera-based inspection of assembled boards against the design data, catching missing, shifted, and misoriented parts and most solder defects at line speed. AOI is the workhorse verification behind the acceptability standards, and asking where it sits in a supplier's line, after paste, after placement, after reflow, is a fair and revealing process question.
Ball grid arrayBGA
The package family whose connections are solder balls underneath the part, invisible after soldering, which is why BGA work is judged by X-ray rather than eyesight. BGAs raise the technology floor of a job: fine ball pitches, voiding limits, and rework skill all become supplier-selection questions the moment one lands on the bill of materials.
Bill of materialsBOM
The parts list that is functionally the product's specification: every line is a manufacturer part number with its approved manufacturers, reference designators, and quantities, plus the do-not-place notes. Quotes are only comparable when the BOM is complete and current, and most quoting delays trace to lines that are ambiguous, obsolete, or missing their approved alternates.
Bottom-terminated components
The leadless package families, QFN and DFN chief among them, whose connections are pads under the body, as common as BGAs on industrial boards and raising the same questions: joints judged by X-ray rather than eyesight, voiding watched, rework a skill rather than a touch-up. Their presence on a BOM belongs in the technology-floor conversation, and their thermal pads are a classic DFM topic the review should reach before the stencil does.
Box build
Assembly beyond the board: enclosures, wiring, displays, sub-assemblies, loaded software, and packaging, up to a finished, tested product shipped under your label. Box build moves the supplier relationship from board vendor toward manufacturing partner, and it pulls in the adjacent purchases, enclosures from the sheet metal world, harnesses from theirs, under one roof or one coordinator.
Component lifecycle
Where each part stands in its maker's catalog: active, not recommended for new designs (NRND), end of life (EOL), or discontinued. Lifecycle is screened at the BOM line level before quoting, because a single dying part can force a redesign, a lifetime buy, or a broker hunt, and the screen is cheap while the surprise is not.
Conformal coating
The thin protective film applied over an assembled board against moisture, condensation, and contamination, specified by material family, coverage areas, and keep-out zones. Coating is a process with its own acceptance criteria, and a drawing that marks what must be coated and what must stay bare has prevented the classic masking dispute.
Consigned and turnkey
The sector's two commercial models: consigned, where you buy the components and the assembler provides labor and process, and turnkey, where the assembler buys everything against your approved list. Hybrids are common: consigning critical or allocated parts while the assembler buys commodity lines, and the choice shifts procurement risk more than it changes the board.
Counterfeit components
Parts that are not what their markings claim: remarked date codes, refurbished pulls, or outright fakes that enter through unauthorized channels and fail later. The defense is channel discipline: franchised distribution first, independent sources only under a stated inspection and traceability policy, because a counterfeit is a field failure with a purchase order behind it.
Design data package
The files that define the board and the build: fabrication data in Gerber or ODB++ formats, drill files, the BOM, assembly drawings, and pick-and-place centroids. It is the specification the quote is priced from and the asset your portability depends on, so completeness is checked at RFQ time and ownership is written down.
Design for manufacturabilityDFM
The review that reconciles a design with the process that must build it: footprints, spacings, panel layout, testability, and solderability, fed back before boards are ordered. A supplier's DFM comments are free engineering and a preview of their seriousness, and the cheapest changes in this sector are the ones made before the first article exists.
First article inspectionFAI
Full verification of initial assemblies against the drawing and acceptance class; the qualification gate before quantity production, with the aerospace world formalizing it as the AS9102 report. It is where new product introduction hands off to production, and tying it to acceptance and payment is standard discipline rather than distrust.
Flying probe test
Electrical test by moving probes rather than a fixed fixture: slower per board, but with no fixture to build, which is why it owns prototypes and low volumes. The crossover to fixtured in-circuit test is an arithmetic of volume against fixture cost, and a supplier should be able to show that arithmetic on request.
Functional test
Testing the assembly as the product: powered, exercised through its real behavior, against pass and fail limits you define. Functional test finds what structural tests cannot, and its fixtures and programs are engineered items, owned, documented, and portable by the same rules as any other tooling.
High-density interconnectHDI
Board construction using microvias, very fine traces, and thin dielectrics to route fine-pitch parts, built by a narrower set of fabricators with laser drilling and sequential lamination. HDI on a design is a supplier-sorting fact on the bare-board side and a cost driver worth confirming early, because not every board shop lives there.
In-circuit testICT
Electrical test through a bed-of-nails fixture pressing on designed-in test points, verifying components and connections quickly at volume. The fixture is a per-design engineering charge, which is why ICT belongs to production quantities, why test points belong in the layout from the start, and why the fixture's ownership belongs in the order.
IPC classes
The three-level language of how good the work must be: Class 1 for general electronics, Class 2 for dedicated-service products that must be reliable, Class 3 for high-reliability work where failure is not acceptable. The class drives cost, inspection, and process control; it is specified in writing with the standard and revision named, and exceptions can be drawn per reference designator when only part of a board is critical.
Laminate and glass transition
The board's base material and the temperature behavior that selects it: the glass-epoxy family at the center, graded by glass transition temperature, the point where the resin softens and expansion accelerates, with higher-performance resins beyond for thermal, frequency, and reliability demands. Laminate is chosen based on assembly temperatures and service life; it is a real cost driver and a fabricator-sorting fact, and it is named on the fabrication drawing, not inherited.
Moisture sensitivity levelMSL
The rating on moisture-sensitive packages states how long they may sit in factory air before soldering: level 1 is unlimited, the middle levels count down, level 3 allows one week, and level 6 requires baking before use. Absorbed moisture flashing to steam in reflow cracks packages from within, so dry storage, cumulative floor-life clocks, and baking discipline are things a serious assembler can show you.
New product introductionNPI
The structured path from design files to repeatable production: DFM review, prototype builds, test development, first articles, and the process documentation that survives the handoff. NPI is a service worth buying deliberately, and the classic mistake is treating a prototype vendor's heroics as evidence of production readiness, in either direction.
Panelization
Building boards in multi-up panels joined by breakaway tabs or scored routes, the format assembly lines actually run. Panel layout is decided with the assembler during DFM; it affects price through utilization and handling, and the depaneling method is specified because tab remnants and stresses land at board edges where connectors like to live.
Reflow soldering
The core surface-mount process: printed solder paste, placed parts, and a tuned journey through a reflow oven whose profile melts and forms every joint at once, with lead-free alloys peaking around 250 degrees Celsius. The profile is engineering, not a setting, which is why moisture-sensitive parts, laminate choices, and large thermal masses all come up in process conversations.
Restriction of Hazardous SubstancesRoHS
The regulatory regime restricts lead and other substances in electronics sold in many markets; this is why lead-free soldering is the default and exemptions are declared rather than assumed. Compliance travels with declarations and material data through the supply chain, and an RFQ states the target markets so the build is compliant where the product will actually go.
Selective soldering and through-hole (THT)
The processes for leaded parts on otherwise surface-mount boards: wave soldering for through-hole-heavy designs, selective soldering machines for the few connectors and headers surface-mount designs still carry, and hand soldering, governed by the same process standard, at the small end. Mixed-technology boards are normal; the mix belongs in the quote because it drives routing and labor.
Solder paste and stencil
The paste of powdered alloy and flux printed onto pads through a laser-cut stencil, the step where most soldering quality is actually decided. The stencil is a per-design tool with an owner; printing is monitored by inspection, and paste discipline, storage, life, and handling, is one of the quiet markers of a well-run line.
Stackup
The board's construction recipe: layer count, copper weights, dielectric materials, and thicknesses, agreed between designer and fabricator. Stackup determines cost and which fabricators can quote, and it specifies controlled impedance rather than hoping for it: signals that need defined impedance get called out, the fabricator tunes geometry to hit them, and test coupons on the panel prove it. Confirming stackup with the board shop before release is the bare-board version of the strip-layout review, cheap early and expensive late.
Surface finishes
The coating on the bare board's copper that keeps it solderable: hot air solder leveling (HASL), the economical legacy finish, and electroless nickel immersion gold (ENIG), which flat-finish fine-pitch work prefers, among others. The finish is chosen based on the component mix and shelf-life needs, as noted on the fabrication drawing, and confirmed rather than left to a default.
Surface-mount technologySMT
The dominant assembly technology: components placed onto printed solder paste and reflowed, at machine speeds, with passive parts down to the 01005 size, smaller than a grain of sand. SMT capability defines an assembler's technology floor, so the smallest package and finest pitch on your BOM are supplier-selection facts, not trivia.
X-ray inspection
Inspection that sees through packages to the joints beneath them, the only way to judge BGA and bottom-terminated solder connections, voiding above all. If the design carries hidden-joint packages, X-ray belongs in the process and in the quote, and asking to see a sample image is a fair capability check.